Sanken HWM900-004 Power Supply Panasonic Flip Chip Bonder System Used Working DEVICENET MASTER-SLAVE UNIT (Qty

DEVICENET MASTER-SLAVE UNIT (Qty

Model No: 3208-000147-11

Part No: GT1155HS-QSBDTL1

img{max-width:100%} Lam Research 810-503-3 RF Automatch Controller PCB 710-503-3 Working Surplus

Inventory # 12719

Sanken HWM900-004 Power Supply Panasonic Flip Chip Bonder System Used Working DEVICENET MASTER-SLAVE UNIT (QtySanken HWM900 004 Power Supply Panasonic Flip Chip Bonder System Used Working Inventory # A 13825 Part No: HWM900 004 Input: 120 230VAC, 13A, 50 60Hz Output: 5V 40A, 12V 8. 3A, 12V 8. 3A, 24V 4. 1A, 36V 5. 6A Removed from a Panasonic FB30T M Create Flip Chip Bonder System Made in Japan This Sanken HWM900 004 Power Supply is used working surplus. Removed from a Panasonic FB30T M Create Flip Chip Bonder System. The physical condition is good, but there